Innerlayer surface treatment◆ Black/Brown Oxide process
◆ Jetcoat process (Oxide replacement)
Lamination application- High Tg base material
◆ It is intended to increase the adhesive strength between the inner layer and prepreg.
◆ It is named based on the board color of its surface treatment.
◆ Compare to black oxide, it has less processing steps and is pink-ring free.
◆ Oxide replacement has good strength, preventing if from peeling even after heatshocking.
◆ The brown oxide prevents delamination when enhancing the adhesive strength between prepreg and Cu.
◆ The Jetcoat HT process is able to maintain its high peel strength at law Etch Rate.
DLD (Black Oxide Process & Jetcoat Process Direct Laser Drilling)» Less process steps
» Better registration
» Cost reduction
Advantage:
» Excellent surface uniformity
» Consistent weight gain
» Superior anti-scratching capability
Vertical Process-Direct Laser Drilling
◆ Black Oxide LD Process
◆ Excellent surface uniformity
◆ Consistent weight gain
◆ Superior anti-scratching capability
◆ Consistent Hole size
◆ Minimizing the undercut
Horizontal Process-Direct Laser Drilling
◆ Black Oxide LD-H Process
◆ Controlled crystal growth
◆ Easy to operate thinner PCB
◆ Provided the most stable and most uniform surface treatment
◆ Significantly less surface copper thickness loss after process
◆ Best for MSAP application with ultra thin copper clad