Electroless Copper MBElectroless Copper MB is a Lower internal stress electroless copper
◆ Application : advanced materials as Rigid-Flex, 5G,Low dk/df, highTg materials.
Compatible with different equipment system
◆ Vertical equipment
◆ Horizontal equipment
◆ Vertical continues equipment
» Friendly complexing agent based on tartrate
» Superior hole wall adhesion for Helogen-free and High Tg base material
» Helogen-free and High Tg base
» Enhance electroless copper adhesion on rigid and flex base materials
» Low stress deposit,without Blister onthe flex and High Tg base materialAfter elecgtroless Cu
Electroless Copper HTElectroless Copper HT, High throwing power electroless copper
◆ Application : advanced HDI, any-Layer,MSAP technology, best for High-end IC substrate
◆ Throwing power (TP) = B1+B2 / T1+T2 x 100%
Electroless Copper HT◆ Excellent throwing power performance
◆ Electroless Copper HT providesa superior throwing power of blindmicro vias.
◆ Electroless Copper HT is fully compatible to Jetchem's established Desmear and PTH processes for Horizontal technology.
◆ Highest reliability performance