ABF Process applicationDesmear ABF
◆ Desmear ABF series is a advance desmear process for high-end IC substrate with Semi-Additive Proecss(SAP)
◆ Excellent micro roughness on ABF materials for Supreme good adhesion with the electorless copper and plating copper.
Electroless Copper ABF
◆ Special design for high-end IC substrates under SAP and MSAP application
» High throwing power
» Excellent coverage and adhesion on ABF material
» Low internal stress deposition
» Environmentally friendly composition, EDTA free,cyanide free
» High peel strength under low Ra material
» High Purity copper depositionwith low resistivity, good for via filling performance.
» After Desmear Prodess (GL-102)
» After Electroless Cu Process (GL-102)